Post Cured Film Performance

Physical properties Measurement TMMFTM S2000 & TMMRTM S2000
Tg (℃) DMA 230
CTE (ppm/℃) TMA 65
Tensile strength (MPa) Tensile 60.3
Elongation (%) 4.4
Young’s modulus (GPa) 2.1
5% Thermal decomposition (℃) TG/DTA 320
Vickers Hardness (HV) Push-In 28.1
Martens Hardness (N/mm2) 199
Young’s modulus (GPa) 3.8
Water absorption (%) 23 ℃-24 h dipping 1.8
Transmittance (%) 500 nm UV 93
600 nm 95
700 nm 98
800 nm 99

 

Contact Us about TMMFTM S2000 & TMMRTM S2000 series

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MEMS Engineer Forum 2017        出展のお知らせ

● 会期 : 2017年4月26日(水) ~ 27日(木)
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