Post Cure Chemical Resistance

Category Chemical Dipping Result
Solvent NMP 80 ℃-15 min No change
GBL 80 ℃-15 min No change
EL 23 ℃-15 min No change
Acetone 23 ℃-15 min No change
PGMEA 23 ℃-15 min No change
IPA 23 ℃-15 min No change
DMSO 80 ℃-15 min No change
Alkaline solution 25% NaOH 40 ℃-10 min No change
10% KOH 40 ℃-10 min No change
TMAH 2.38% 40 ℃-10 min No change
Acid solution H2SO4/H2O2 40 ℃-10 min No change
1% HF 23 ℃-5 min No change

 

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MEMS Engineer Forum 2017        出展のお知らせ

● 会期 : 2017年4月26日(水) ~ 27日(木)
● 会場 : 両国 KFCホール
● 展示会URL : https://www.m-e-f.info/